Kulicke and Soffa Industries (NASDAQ: KLIC) and Chipmos Technologies (NASDAQ:IMOS) are both small-cap computer and technology companies, but which is the superior stock? We will contrast the two businesses based on the strength of their institutional ownership, earnings, profitability, risk, analyst recommendations, valuation and dividends.
This table compares Kulicke and Soffa Industries and Chipmos Technologies’ net margins, return on equity and return on assets.
|Net Margins||Return on Equity||Return on Assets|
|Kulicke and Soffa Industries||11.61%||11.88%||9.53%|
Risk and Volatility
Kulicke and Soffa Industries has a beta of 1.33, suggesting that its stock price is 33% more volatile than the S&P 500. Comparatively, Chipmos Technologies has a beta of 0.46, suggesting that its stock price is 54% less volatile than the S&P 500.
Chipmos Technologies pays an annual dividend of $1.49 per share and has a dividend yield of 7.0%. Kulicke and Soffa Industries does not pay a dividend. Chipmos Technologies pays out 59.1% of its earnings in the form of a dividend.
This is a summary of recent ratings and price targets for Kulicke and Soffa Industries and Chipmos Technologies, as provided by MarketBeat.
|Sell Ratings||Hold Ratings||Buy Ratings||Strong Buy Ratings||Rating Score|
|Kulicke and Soffa Industries||0||1||1||0||2.50|
Kulicke and Soffa Industries currently has a consensus price target of $31.00, indicating a potential upside of 41.10%. Given Kulicke and Soffa Industries’ higher possible upside, analysts plainly believe Kulicke and Soffa Industries is more favorable than Chipmos Technologies.
Insider & Institutional Ownership
84.9% of Kulicke and Soffa Industries shares are owned by institutional investors. Comparatively, 19.4% of Chipmos Technologies shares are owned by institutional investors. 1.0% of Kulicke and Soffa Industries shares are owned by company insiders. Strong institutional ownership is an indication that hedge funds, endowments and large money managers believe a company will outperform the market over the long term.
Valuation & Earnings
This table compares Kulicke and Soffa Industries and Chipmos Technologies’ gross revenue, earnings per share (EPS) and valuation.
|Gross Revenue||Price/Sales Ratio||EBITDA||Earnings Per Share||Price/Earnings Ratio|
|Kulicke and Soffa Industries||$738.99 million||2.11||$125.75 million||$1.20||18.31|
Kulicke and Soffa Industries has higher revenue and earnings than Chipmos Technologies. Chipmos Technologies is trading at a lower price-to-earnings ratio than Kulicke and Soffa Industries, indicating that it is currently the more affordable of the two stocks.
Kulicke and Soffa Industries beats Chipmos Technologies on 9 of the 13 factors compared between the two stocks.
Kulicke and Soffa Industries Company Profile
Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools, as well as services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. The Company operates through two segments: Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The Expendable Tools segment manufactures and sells expendable tools for a range of semiconductor packaging applications. It offers capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits, high and low powered discrete devices, light-emitting diodes and power modules. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers and automotive electronics suppliers.
Chipmos Technologies Company Profile
ChipMOS TECHNOLOGIES INC is a Taiwan-based company principally engaged in the integrated circuits packaging and testing business. The Company mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services, among others. The Company’s products and services are used in information products, personal computers, communications equipment, office automation and consumer electronics. It mainly operates its business within domestic market, and in overseas markets, including the rest of Asia and the Americas.
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