Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC – Get Free Report) announced a quarterly dividend on Thursday, March 6th, RTT News reports. Investors of record on Thursday, March 20th will be given a dividend of 0.205 per share by the semiconductor company on Tuesday, April 8th. This represents a $0.82 dividend on an annualized basis and a dividend yield of 2.23%. The ex-dividend date of this dividend is Thursday, March 20th.
Kulicke and Soffa Industries has raised its dividend by an average of 10.9% annually over the last three years. Kulicke and Soffa Industries has a dividend payout ratio of 36.3% meaning its dividend is sufficiently covered by earnings. Equities analysts expect Kulicke and Soffa Industries to earn $1.73 per share next year, which means the company should continue to be able to cover its $0.82 annual dividend with an expected future payout ratio of 47.4%.
Kulicke and Soffa Industries Stock Performance
NASDAQ KLIC opened at $36.85 on Tuesday. The business’s 50 day moving average price is $42.05 and its 200-day moving average price is $44.36. Kulicke and Soffa Industries has a fifty-two week low of $35.04 and a fifty-two week high of $53.71. The company has a market cap of $1.97 billion, a P/E ratio of 307.08 and a beta of 1.38.
Analysts Set New Price Targets
KLIC has been the topic of several research reports. Needham & Company LLC restated a “buy” rating and issued a $53.00 target price on shares of Kulicke and Soffa Industries in a research report on Thursday, February 6th. StockNews.com raised Kulicke and Soffa Industries from a “sell” rating to a “hold” rating in a research note on Thursday, February 6th. Three equities research analysts have rated the stock with a hold rating and three have given a buy rating to the stock. Based on data from MarketBeat.com, the stock currently has an average rating of “Moderate Buy” and an average target price of $52.00.
Get Our Latest Stock Report on KLIC
Kulicke and Soffa Industries Company Profile
Kulicke and Soffa Industries, Inc designs, manufactures, and sells capital equipment and tools used to assemble semiconductor devices. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company offers ball bonding equipment, wafer level bonding equipment, wedge bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares and services for equipment.
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