Firan Technology Group (TSE:FTG) Shares Cross Above 50 Day Moving Average – Time to Sell?

Firan Technology Group Co. (TSE:FTG) crossed above its 50-day moving average during trading on Friday . The stock has a 50-day moving average of C$7.60 and traded as high as C$8.92. Firan Technology Group shares last traded at C$8.65, with a volume of 42,772 shares.

Wall Street Analysts Forecast Growth

Several research firms have issued reports on FTG. Acumen Capital boosted their target price on Firan Technology Group from C$11.50 to C$12.00 and gave the stock a “buy” rating in a research report on Friday, April 11th. Raymond James raised Firan Technology Group to a “moderate buy” rating in a report on Tuesday, April 8th.

Firan Technology Group Trading Down 1.6 %

The business’s fifty day moving average is C$7.60 and its 200 day moving average is C$7.45. The company has a quick ratio of 1.53, a current ratio of 2.54 and a debt-to-equity ratio of 50.28. The stock has a market cap of C$218.01 million, a PE ratio of 20.28 and a beta of 1.45.

Insiders Place Their Bets

In other Firan Technology Group news, Director Mike Andrade purchased 10,000 shares of Firan Technology Group stock in a transaction on Friday, April 11th. The shares were bought at an average price of C$7.80 per share, with a total value of C$78,000.00. Also, Senior Officer James Crichton sold 10,400 shares of the company’s stock in a transaction that occurred on Monday, February 24th. The shares were sold at an average price of C$8.08, for a total value of C$84,032.00. Over the last ninety days, insiders have bought 15,100 shares of company stock worth $116,548. 32.64% of the stock is owned by corporate insiders.

Firan Technology Group Company Profile

Firan Technology Group Corporation manufactures and sells aerospace and defense electronic products and subsystems in Canada, the United States, Asia, Europe, and rest of Americas. The company operates in two segments, FTG Circuits and FTG Aerospace. It offers semi additive process technologies, high density interconnect products, high temperature rigid flex printed, RF boards, thermal management, and rigid flex and assembly products.