Disco (OTCMKTS:DSCSY) Stock Price Down 7.9% – Here’s Why

Disco Corp (OTCMKTS:DSCSYGet Free Report) was down 7.9% during trading on Tuesday . The company traded as low as $45.22 and last traded at $45.55. Approximately 9,638 shares traded hands during mid-day trading, a decline of 97% from the average daily volume of 299,724 shares. The stock had previously closed at $49.45.

Analyst Ratings Changes

Separately, Zacks Research upgraded shares of Disco from a “hold” rating to a “strong-buy” rating in a research report on Monday, April 20th. Two research analysts have rated the stock with a Strong Buy rating, Based on data from MarketBeat.com, the stock has a consensus rating of “Strong Buy”.

Get Our Latest Analysis on Disco

Disco Price Performance

The business has a 50 day simple moving average of $44.40 and a 200 day simple moving average of $38.94. The company has a market capitalization of $48.20 billion, a price-to-earnings ratio of 54.18 and a beta of 1.63.

Disco (OTCMKTS:DSCSYGet Free Report) last posted its quarterly earnings data on Wednesday, April 22nd. The company reported $0.25 EPS for the quarter. Disco had a net margin of 30.95% and a return on equity of 26.03%. The business had revenue of $848.13 million during the quarter, compared to analyst estimates of $771.53 million. On average, equities research analysts predict that Disco Corp will post 1.07 EPS for the current year.

Disco Company Profile

(Get Free Report)

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

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