BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report)’s stock price hit a new 52-week high during mid-day trading on Thursday . The stock traded as high as $315.00 and last traded at $314.78, with a volume of 670 shares trading hands. The stock had previously closed at $308.3101.
Analyst Ratings Changes
Several equities analysts recently issued reports on the company. Berenberg Bank raised BE Semiconductor Industries to a “hold” rating in a research note on Monday, February 23rd. Morgan Stanley reissued an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday. Deutsche Bank Aktiengesellschaft reaffirmed a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. Finally, Zacks Research upgraded BE Semiconductor Industries to a “strong-buy” rating in a research note on Thursday, April 23rd. One analyst has rated the stock with a Strong Buy rating, five have given a Buy rating and four have assigned a Hold rating to the company’s stock. According to data from MarketBeat, the company presently has a consensus rating of “Moderate Buy”.
Read Our Latest Report on BESIY
BE Semiconductor Industries Price Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last announced its quarterly earnings results on Thursday, April 23rd. The technology company reported $0.76 earnings per share for the quarter, hitting analysts’ consensus estimates of $0.76. The business had revenue of $216.51 million for the quarter, compared to analysts’ expectations of $220.77 million. BE Semiconductor Industries had a return on equity of 40.69% and a net margin of 24.02%. As a group, research analysts forecast that BE Semiconductor Industries NV will post 4.46 EPS for the current year.
About BE Semiconductor Industries
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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