BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report)’s stock price traded down 10.2% on Monday . The stock traded as low as $285.79 and last traded at $285.79. Approximately 1,061 shares changed hands during trading, a decline of 85% from the average session volume of 7,277 shares. The stock had previously closed at $318.26.
Analysts Set New Price Targets
A number of equities research analysts recently weighed in on the stock. Zacks Research cut shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research report on Friday, June 26th. Morgan Stanley reaffirmed an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, May 19th. Finally, Deutsche Bank Aktiengesellschaft reiterated a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. Five analysts have rated the stock with a Buy rating and four have issued a Hold rating to the stock. Based on data from MarketBeat.com, BE Semiconductor Industries presently has a consensus rating of “Moderate Buy”.
View Our Latest Stock Analysis on BESIY
BE Semiconductor Industries Stock Down 5.6%
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last posted its quarterly earnings data on Thursday, April 23rd. The technology company reported $0.76 earnings per share for the quarter, hitting analysts’ consensus estimates of $0.76. The company had revenue of $216.51 million during the quarter, compared to analysts’ expectations of $220.77 million. BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%. As a group, sell-side analysts forecast that BE Semiconductor Industries NV will post 4.45 earnings per share for the current fiscal year.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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