Disco (OTCMKTS:DSCSY) Shares Gap Up – What’s Next?

Disco Corp (OTCMKTS:DSCSY)’s stock price gapped up prior to trading on Monday . The stock had previously closed at $36.37, but opened at $38.42. Disco shares last traded at $37.69, with a volume of 86,389 shares trading hands.

Analyst Upgrades and Downgrades

Several equities research analysts recently commented on DSCSY shares. Zacks Research lowered Disco from a “strong-buy” rating to a “hold” rating in a research report on Tuesday, May 19th. Jefferies Financial Group upgraded shares of Disco from a “hold” rating to a “buy” rating in a research note on Monday. One investment analyst has rated the stock with a Buy rating and one has assigned a Hold rating to the company. According to MarketBeat.com, Disco currently has an average rating of “Moderate Buy”.

Disco Trading Down 11.2%

The stock has a market capitalization of $35.59 billion, a PE ratio of 37.71 and a beta of 1.50. The firm has a 50-day moving average price of $44.89 and a 200-day moving average price of $44.34.

Disco (OTCMKTS:DSCSY) last announced its quarterly earnings data on Thursday, July 23rd. The company reported $0.20 earnings per share for the quarter. The business had revenue of $717.28 million during the quarter. Disco had a return on equity of 26.08% and a net margin of 31.65%. Sell-side analysts expect that Disco Corp will post 1.05 earnings per share for the current fiscal year.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.