Short Interest in Disco Corp (OTCMKTS:DSCSY) Declines By 86.6%

Disco Corp (OTCMKTS:DSCSY) saw a large drop in short interest in April. As of April 30th, there was short interest totaling 19,942 shares, a drop of 86.6% from the April 15th total of 149,045 shares. Currently, 0.0% of the shares of the stock are short sold. Based on an average daily volume of 202,001 shares, the short-interest ratio is currently 0.1 days.

Disco Stock Down 3.6%

Shares of Disco stock traded down $1.70 on Tuesday, hitting $45.40. 11,768 shares of the company were exchanged, compared to its average volume of 296,395. The company has a 50-day moving average price of $44.40 and a 200 day moving average price of $38.94. The stock has a market capitalization of $49.25 billion, a price-to-earnings ratio of 55.37 and a beta of 1.63. Disco has a 1-year low of $22.00 and a 1-year high of $52.99.

Disco (OTCMKTS:DSCSY) last posted its quarterly earnings results on Wednesday, April 22nd. The company reported $0.25 EPS for the quarter. The firm had revenue of $848.13 million during the quarter, compared to analysts’ expectations of $771.53 million. Disco had a return on equity of 26.03% and a net margin of 30.95%. Research analysts forecast that Disco will post 1.07 EPS for the current year.

Wall Street Analysts Forecast Growth

Separately, Zacks Research raised shares of Disco from a “hold” rating to a “strong-buy” rating in a report on Monday, April 20th. Two equities research analysts have rated the stock with a Strong Buy rating, Based on data from MarketBeat.com, the stock has an average rating of “Strong Buy”.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.