Shares of BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) gapped up prior to trading on Thursday . The stock had previously closed at $336.84, but opened at $358.60. BE Semiconductor Industries shares last traded at $359.4375, with a volume of 743 shares trading hands.
Analyst Ratings Changes
Several analysts have weighed in on the company. Berenberg Bank upgraded BE Semiconductor Industries to a “hold” rating in a research report on Monday, February 23rd. Deutsche Bank Aktiengesellschaft reiterated a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, May 19th. Finally, Zacks Research upgraded BE Semiconductor Industries to a “strong-buy” rating in a research report on Thursday, April 23rd. One investment analyst has rated the stock with a Strong Buy rating, five have given a Buy rating and four have given a Hold rating to the company. Based on data from MarketBeat, the company presently has an average rating of “Moderate Buy”.
Check Out Our Latest Stock Report on BE Semiconductor Industries
BE Semiconductor Industries Stock Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last posted its quarterly earnings data on Thursday, April 23rd. The technology company reported $0.76 earnings per share (EPS) for the quarter, hitting analysts’ consensus estimates of $0.76. The business had revenue of $216.51 million during the quarter, compared to the consensus estimate of $220.77 million. BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%. On average, sell-side analysts predict that BE Semiconductor Industries NV will post 4.46 EPS for the current fiscal year.
About BE Semiconductor Industries
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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