Shares of BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) gapped down prior to trading on Tuesday . The stock had previously closed at $365.70, but opened at $346.44. BE Semiconductor Industries shares last traded at $346.44, with a volume of 792 shares trading hands.
Analysts Set New Price Targets
Several brokerages have recently weighed in on BESIY. Zacks Research raised BE Semiconductor Industries to a “strong-buy” rating in a research note on Thursday, April 23rd. Deutsche Bank Aktiengesellschaft reissued a “buy” rating on shares of BE Semiconductor Industries in a research note on Friday, May 15th. Berenberg Bank raised BE Semiconductor Industries to a “hold” rating in a research note on Monday, February 23rd. Finally, Morgan Stanley reissued an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, May 19th. One analyst has rated the stock with a Strong Buy rating, five have assigned a Buy rating and four have given a Hold rating to the stock. According to MarketBeat, BE Semiconductor Industries presently has an average rating of “Moderate Buy”.
Get Our Latest Stock Report on BESIY
BE Semiconductor Industries Stock Up 4.5%
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last released its earnings results on Thursday, April 23rd. The technology company reported $0.76 earnings per share (EPS) for the quarter, meeting analysts’ consensus estimates of $0.76. BE Semiconductor Industries had a net margin of 24.02% and a return on equity of 38.42%. The company had revenue of $216.51 million for the quarter, compared to the consensus estimate of $220.77 million. On average, analysts anticipate that BE Semiconductor Industries NV will post 4.45 earnings per share for the current fiscal year.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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