Disco (OTCMKTS:DSCSY) Shares Down 11.2% – Should You Sell?

Disco Corp (OTCMKTS:DSCSYGet Free Report) shares dropped 11.2% on Wednesday . The company traded as low as $41.82 and last traded at $42.77. Approximately 24,520 shares were traded during mid-day trading, a decline of 92% from the average session volume of 300,672 shares. The stock had previously closed at $48.17.

Analysts Set New Price Targets

Separately, Zacks Research cut Disco from a “strong-buy” rating to a “hold” rating in a research report on Tuesday, May 19th. One research analyst has rated the stock with a Hold rating, According to MarketBeat.com, Disco presently has a consensus rating of “Hold”.

Check Out Our Latest Research Report on Disco

Disco Price Performance

The company has a market cap of $49.28 billion, a price-to-earnings ratio of 55.40 and a beta of 1.50. The firm has a fifty day simple moving average of $46.22 and a 200 day simple moving average of $43.50.

Disco (OTCMKTS:DSCSYGet Free Report) last issued its quarterly earnings data on Wednesday, April 22nd. The company reported $0.25 earnings per share for the quarter. The business had revenue of $848.13 million during the quarter, compared to analysts’ expectations of $771.53 million. Disco had a net margin of 30.95% and a return on equity of 25.27%. Analysts expect that Disco Corp will post 1.05 earnings per share for the current year.

Disco Company Profile

(Get Free Report)

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

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