Disco (OTCMKTS:DSCSY) Shares Gap Up – Still a Buy?

Disco Corp (OTCMKTS:DSCSY)’s stock price gapped up prior to trading on Monday . The stock had previously closed at $37.61, but opened at $39.47. Disco shares last traded at $39.53, with a volume of 38,666 shares trading hands.

Analysts Set New Price Targets

Several equities research analysts have issued reports on DSCSY shares. Zacks Research cut shares of Disco from a “strong-buy” rating to a “hold” rating in a research note on Tuesday, May 19th. Jefferies Financial Group raised shares of Disco from a “hold” rating to a “buy” rating in a research report on Monday, July 27th. One analyst has rated the stock with a Buy rating and one has given a Hold rating to the company’s stock. Based on data from MarketBeat, the company has an average rating of “Moderate Buy”.

Disco Stock Up 0.6%

The firm has a market cap of $42.25 billion, a price-to-earnings ratio of 44.77 and a beta of 1.55. The firm has a fifty day moving average price of $44.06 and a 200-day moving average price of $44.34.

Disco (OTCMKTS:DSCSY) last released its earnings results on Thursday, July 23rd. The company reported $0.20 EPS for the quarter. Disco had a return on equity of 26.03% and a net margin of 31.65%.The firm had revenue of $717.28 million during the quarter. Equities research analysts anticipate that Disco Corp will post 1.05 earnings per share for the current fiscal year.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.