Applied Materials, Inc. (NASDAQ:AMAT – Get Free Report) declared a quarterly dividend on Tuesday, June 9th. Shareholders of record on Thursday, August 20th will be given a dividend of 0.53 per share by the manufacturing equipment provider on Thursday, September 10th. This represents a c) annualized dividend and a yield of 0.4%. The ex-dividend date is Thursday, August 20th.
Applied Materials has increased its dividend payment by an average of 0.1%annually over the last three years and has increased its dividend annually for the last 8 consecutive years. Applied Materials has a dividend payout ratio of 21.0% indicating that its dividend is sufficiently covered by earnings. Equities research analysts expect Applied Materials to earn $16.89 per share next year, which means the company should continue to be able to cover its $2.12 annual dividend with an expected future payout ratio of 12.6%.
Applied Materials Stock Up 5.5%
Shares of AMAT opened at $535.31 on Tuesday. The business’s fifty day moving average price is $565.01 and its two-hundred day moving average price is $447.20. The firm has a market capitalization of $425.01 billion, a price-to-earnings ratio of 46.15, a PEG ratio of 1.25 and a beta of 1.61. Applied Materials has a 52 week low of $154.46 and a 52 week high of $739.67. The company has a debt-to-equity ratio of 0.20, a quick ratio of 1.79 and a current ratio of 2.42.
Applied Materials Company Profile
Applied Materials, Inc is a U.S.-based supplier of equipment, services and software used to manufacture semiconductor chips, flat panel displays and other advanced materials. Headquartered in Santa Clara, California, the company designs and sells capital equipment and related technologies that enable production of integrated circuits, display panels and materials used across the electronics supply chain.
Applied Materials’ offerings include process equipment and factory software that support critical steps in device fabrication, such as deposition, etch, implantation, inspection and metrology, as well as systems for packaging and advanced heterogeneous integration.
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