Disco Corp (OTCMKTS:DSCSY – Get Free Report) was the target of a large growth in short interest in August. As of August 31st, there was short interest totaling 46,196 shares, a growth of 203.0% from the August 15th total of 15,246 shares. Based on an average daily volume of 311,923 shares, the days-to-cover ratio is currently 0.1 days. Currently, 0.0% of the shares of the stock are short sold.
Disco Stock Performance
Shares of OTCMKTS:DSCSY traded up $0.54 during midday trading on Friday, reaching $34.34. The company had a trading volume of 164,405 shares, compared to its average volume of 196,322. The company has a fifty day simple moving average of $38.67 and a two-hundred day simple moving average of $42.99. The firm has a market cap of $37.26 billion, a price-to-earnings ratio of 39.47 and a beta of 1.54. Disco has a 1-year low of $26.33 and a 1-year high of $58.00.
Disco (OTCMKTS:DSCSY – Get Free Report) last posted its quarterly earnings data on Thursday, July 23rd. The company reported $0.20 earnings per share (EPS) for the quarter. Disco had a return on equity of 26.03% and a net margin of 31.65%.The firm had revenue of $717.28 million for the quarter. Analysts expect that Disco will post 1.05 EPS for the current year.
Institutional Investors Weigh In On Disco
Analyst Upgrades and Downgrades
A number of analysts recently weighed in on the stock. Jefferies Financial Group upgraded shares of Disco from a “hold” rating to a “buy” rating in a report on Monday, July 27th. Zacks Research cut Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One analyst has rated the stock with a Buy rating and one has assigned a Hold rating to the company’s stock. According to MarketBeat, Disco has an average rating of “Moderate Buy”.
Check Out Our Latest Research Report on DSCSY
Disco Company Profile
DISCO Corporation, traded in the United States under the symbol DSCSY, is a Japanese manufacturer of precision processing equipment and tools used primarily in semiconductor and electronic-component production. The company develops technologies for cutting, grinding and polishing hard, brittle materials such as silicon, compound semiconductors, glass and ceramics.
Its product portfolio includes wafer-dicing saws, grinding and polishing systems, laser-based processing equipment, and the consumable blades, wheels and other tools used with those machines.
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