First Pacific Financial reduced its holdings in shares of Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM – Free Report) by 3.7% in the 4th quarter, according to the company in its most recent disclosure with the Securities & Exchange Commission. The firm owned 4,948 shares of the semiconductor company’s stock after selling 189 shares during the quarter. First Pacific Financial’s holdings in Taiwan Semiconductor Manufacturing were worth $977,000 at the end of the most recent quarter.
Other large investors also recently made changes to their positions in the company. Private Client Services LLC purchased a new stake in Taiwan Semiconductor Manufacturing during the 4th quarter worth $201,000. Trust Co of the South lifted its stake in shares of Taiwan Semiconductor Manufacturing by 232.8% during the fourth quarter. Trust Co of the South now owns 8,869 shares of the semiconductor company’s stock worth $1,752,000 after purchasing an additional 6,204 shares in the last quarter. Headwater Capital Co Ltd purchased a new stake in shares of Taiwan Semiconductor Manufacturing in the fourth quarter worth about $49,372,000. NRI Wealth Management LC acquired a new stake in shares of Taiwan Semiconductor Manufacturing in the fourth quarter valued at about $1,545,000. Finally, HF Advisory Group LLC raised its holdings in shares of Taiwan Semiconductor Manufacturing by 55.5% during the 3rd quarter. HF Advisory Group LLC now owns 13,755 shares of the semiconductor company’s stock valued at $2,389,000 after buying an additional 4,907 shares during the period. Institutional investors and hedge funds own 16.51% of the company’s stock.
Taiwan Semiconductor Manufacturing Stock Performance
Taiwan Semiconductor Manufacturing stock opened at $215.06 on Friday. The company has a current ratio of 2.57, a quick ratio of 2.30 and a debt-to-equity ratio of 0.24. The stock has a 50 day moving average of $197.53 and a 200-day moving average of $183.96. The stock has a market cap of $1.12 trillion, a P/E ratio of 34.46, a price-to-earnings-growth ratio of 0.76 and a beta of 1.07. Taiwan Semiconductor Manufacturing Company Limited has a 52 week low of $100.00 and a 52 week high of $222.20.
Taiwan Semiconductor Manufacturing Increases Dividend
The company also recently disclosed a quarterly dividend, which will be paid on Thursday, April 10th. Shareholders of record on Tuesday, March 18th will be paid a dividend of $0.5484 per share. The ex-dividend date is Tuesday, March 18th. This represents a $2.19 annualized dividend and a yield of 1.02%. This is a boost from Taiwan Semiconductor Manufacturing’s previous quarterly dividend of $0.49. Taiwan Semiconductor Manufacturing’s dividend payout ratio is presently 30.77%.
Analyst Upgrades and Downgrades
A number of equities analysts have weighed in on the company. Needham & Company LLC restated a “buy” rating and issued a $225.00 price target on shares of Taiwan Semiconductor Manufacturing in a report on Thursday. Susquehanna restated a “buy” rating on shares of Taiwan Semiconductor Manufacturing in a research note on Friday, October 18th. StockNews.com downgraded shares of Taiwan Semiconductor Manufacturing from a “buy” rating to a “hold” rating in a research note on Sunday, November 17th. Finally, Barclays boosted their price objective on shares of Taiwan Semiconductor Manufacturing from $215.00 to $240.00 and gave the stock an “overweight” rating in a report on Monday, November 18th. Two analysts have rated the stock with a hold rating and four have given a buy rating to the company. According to MarketBeat, the company has an average rating of “Moderate Buy” and an average target price of $217.00.
Check Out Our Latest Report on TSM
Taiwan Semiconductor Manufacturing Company Profile
Taiwan Semiconductor Manufacturing Company Limited, together with its subsidiaries, manufactures, packages, tests, and sells integrated circuits and other semiconductor devices in Taiwan, China, Europe, the Middle East, Africa, Japan, the United States, and internationally. It provides a range of wafer fabrication processes, including processes to manufacture complementary metal- oxide-semiconductor (CMOS) logic, mixed-signal, radio frequency, embedded memory, bipolar CMOS mixed-signal, and others.
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