Disco Corp (OTCMKTS:DSCSY) Short Interest Update

Disco Corp (OTCMKTS:DSCSY) was the recipient of a large increase in short interest during the month of June. As of June 30th, there was short interest totaling 115,925 shares, an increase of 486.9% from the June 15th total of 19,753 shares. Approximately 0.0% of the shares of the company are sold short. Based on an average trading volume of 782,291 shares, the short-interest ratio is presently 0.1 days.

Disco Trading Down 0.0%

Shares of OTCMKTS:DSCSY traded down $0.01 on Friday, hitting $45.42. The company had a trading volume of 109,302 shares, compared to its average volume of 374,458. The company has a market cap of $49.27 billion, a PE ratio of 55.39 and a beta of 1.50. Disco has a 52-week low of $24.94 and a 52-week high of $58.00. The business has a 50 day moving average of $46.19 and a 200 day moving average of $43.51.

Disco (OTCMKTS:DSCSY) last announced its quarterly earnings results on Wednesday, April 22nd. The company reported $0.25 earnings per share for the quarter. Disco had a net margin of 30.95% and a return on equity of 25.27%. The company had revenue of $848.13 million for the quarter, compared to analyst estimates of $771.53 million. As a group, equities analysts predict that Disco will post 1.05 EPS for the current year.

Analyst Ratings Changes

Separately, Zacks Research lowered Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One research analyst has rated the stock with a Hold rating, According to MarketBeat.com, the stock has a consensus rating of “Hold”.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.