SEI High Yield Bond & Alternative Credit ETF (NASDAQ:LEND) Announces $0.12 Dividend

SEI High Yield Bond & Alternative Credit ETF (NASDAQ:LEND) declared a dividend on Wednesday, September 2nd. Stockholders of record on Thursday, September 3rd will be given a dividend of 0.1206 per share on Friday, September 4th. The ex-dividend date is Thursday, September 3rd.

SEI High Yield Bond & Alternative Credit ETF Trading Up 0.0%

Shares of LEND opened at $24.88 on Thursday. The company has a 50-day simple moving average of $24.98 and a 200-day simple moving average of $21.09. SEI High Yield Bond & Alternative Credit ETF has a 52-week low of $24.79 and a 52-week high of $25.29.