Disco (OTCMKTS:DSCSY) Shares Gap Down – Time to Sell?

Disco Corp (OTCMKTS:DSCSYGet Free Report)’s share price gapped down before the market opened on Thursday . The stock had previously closed at $34.65, but opened at $33.01. Disco shares last traded at $33.4950, with a volume of 1,144 shares traded.

Analyst Ratings Changes

Separately, Jefferies Financial Group raised Disco from a “hold” rating to a “buy” rating in a research note on Monday, July 27th. One analyst has rated the stock with a Buy rating and one has given a Hold rating to the company. According to data from MarketBeat.com, Disco has a consensus rating of “Moderate Buy”.

Get Our Latest Stock Analysis on DSCSY

Disco Stock Performance

The stock’s 50-day moving average is $36.95 and its 200 day moving average is $42.15. The stock has a market capitalization of $36.29 billion, a PE ratio of 38.44 and a beta of 1.54.

Disco (OTCMKTS:DSCSYGet Free Report) last posted its earnings results on Thursday, July 23rd. The company reported $0.20 earnings per share for the quarter. The business had revenue of $717.28 million during the quarter. Disco had a return on equity of 26.03% and a net margin of 31.65%. Analysts expect that Disco Corp will post 1.11 earnings per share for the current year.

Institutional Investors Weigh In On Disco

An institutional investor recently bought a new stake in Disco stock. Azimuth Capital Investment Management LLC acquired a new stake in Disco Corp (OTCMKTS:DSCSYFree Report) in the 2nd quarter, according to the company in its most recent filing with the Securities and Exchange Commission (SEC). The firm acquired 237,250 shares of the company’s stock, valued at approximately $11,862,000. 0.03% of the stock is owned by institutional investors and hedge funds.

Disco Company Profile

(Get Free Report)

DISCO Corporation, traded in the United States under the symbol DSCSY, is a Japanese manufacturer of precision processing equipment and tools used primarily in semiconductor and electronic-component production. The company develops technologies for cutting, grinding and polishing hard, brittle materials such as silicon, compound semiconductors, glass and ceramics.

Its product portfolio includes wafer-dicing saws, grinding and polishing systems, laser-based processing equipment, and the consumable blades, wheels and other tools used with those machines.

Further Reading

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