BE Semiconductor Industries (OTCMKTS:BESIY) Announces Quarterly Earnings Results

BE Semiconductor Industries (OTCMKTS:BESIY) announced its earnings results on Thursday. The technology company reported $1.29 EPS for the quarter, missing the consensus estimate of $1.30 by ($0.01), Zacks reports. BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%.

BE Semiconductor Industries Stock Performance

Shares of BESIY traded down $12.81 on Thursday, reaching $270.99. 420 shares of the company’s stock traded hands, compared to its average volume of 7,741. BE Semiconductor Industries has a 52-week low of $122.81 and a 52-week high of $374.33. The stock has a market cap of $19.65 billion, a PE ratio of 122.62 and a beta of 1.97. The stock’s 50 day simple moving average is $316.28 and its two-hundred day simple moving average is $257.29. The company has a current ratio of 4.74, a quick ratio of 4.17 and a debt-to-equity ratio of 1.11.

Wall Street Analysts Forecast Growth

A number of equities analysts recently weighed in on BESIY shares. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, May 19th. Deutsche Bank Aktiengesellschaft reaffirmed a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. Finally, Zacks Research cut shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research report on Friday, June 26th. Five analysts have rated the stock with a Buy rating and four have assigned a Hold rating to the stock. Based on data from MarketBeat, BE Semiconductor Industries has a consensus rating of “Moderate Buy”.

BE Semiconductor Industries Company Profile

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.